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Wafer Transfer Robot

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For wafers up to 300mm

High-precision, low-vibration double-arm vacuum robot for high-temperature processes



  • Double arm robot for high temperature processes
  • With a direct drive motor mounted on the θ axis,
       Achieves improved device throughput by transporting wafers with low vibration
  • With wafer center misalignment correction function

Specifications *1

Model UTVW-R2800H
Robot Type 4 axis Cylindrical Coordinate
Operation Range X1, X2-axis 670mm
θ-axis 330°
Z-axis 50mm
Max. Operation Speed X1, X2-axis 120°/sec.
θ-axis 100°/sec.
Z-axis 25mm/sec.
Operating Time X1, X2-axis 1.5sec./670mm
θ-axis 2.4sec./180°
Z-axis 1.6sec./50mm
Repeatability XYZ direction: ±0.1mm each (3σ) (*2)
Payload 2.5kg (*3)
Cleanliness ISO Class 3 (ISO-14644)
Mass 85kg
Environment Temperature 15-40°C (Atm. side)/15-80°C (Vacuum Seal Unit)
Humidity 20-70%, No condensation
Pressure Atmospheric pressure 〜 10-6Pa

*1 Transfer perfomance differs from the standard when options are added.
*2 by in our evaluation conditions
*3 including Hand-base,Hand and Wafer