UTVW-R2800H
For wafers up to 300mm
High-precision, low-vibration double-arm vacuum robot for high-temperature processes
Features
- ●Double arm robot for high temperature processes
- ●With a direct drive motor mounted on the θ axis,
Achieves improved device throughput by transporting wafers with low vibration - ●With wafer center misalignment correction function
Specifications *1
| Model | UTVW-R2800H | |
|---|---|---|
| Robot Type | 4 axis Cylindrical Coordinate | |
| Operation Range | X1, X2-axis | 670mm |
| θ-axis | 330° | |
| Z-axis | 50mm | |
| Max. Operation Speed | X1, X2-axis | 120°/sec. |
| θ-axis | 100°/sec. | |
| Z-axis | 25mm/sec. | |
| Operating Time | X1, X2-axis | 1.5sec./670mm |
| θ-axis | 2.4sec./180° | |
| Z-axis | 1.6sec./50mm | |
| Repeatability | XYZ direction: ±0.1mm each (3σ) (*2) | |
| Payload | 2.5kg (*3) | |
| Cleanliness | ISO Class 3 (ISO-14644) | |
| Mass | 85kg | |
| Environment | Temperature | 15-40°C (Atm. side)/15-80°C (Vacuum Seal Unit) |
| Humidity | 20-70%, No condensation | |
| Pressure | Atmospheric pressure 〜 10-6Pa | |
*1 Transfer perfomance differs from the standard when options are added.
*2 by in our evaluation conditions
*3 including Hand-base,Hand and Wafer
