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Wafer Transfer Robot

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UT-VDW3000HS series

For wafers up to 300mm

High-speed, low vibration double-arm vacuum robot that achieves to a significant improvement in equipment throughput by 650wph of ultra high-speed.



  • Achieves 650WPH of ultra high-speed transfer in vacuum
  • Equipped with direct drive motors to significantly reduce vibration during arm operation
  • Improved trajectory accuracy and positioning accuracy by adopting a steel belt for the arm part
  • Wafer slip prevention by adopting high friction pad for end effector
  • With wafer center misalignment correction function

Specifications *1

Model UT-VDW3000HS series
Robot Type 4 axis Cylindrical Coordinate
Operation Range X1, X2-axis 620mm
θ-axis 346°
Z-axis 50mm
Max. Operation Speed X1, X2-axis 380°/sec.
θ-axis 300°/sec.
Z-axis 185mm/sec.
Operating Time X1, X2-axis 0.6sec./620mm
θ-axis 0.7sec./90°
Z-axis 0.25sec./20mm
Repeatability XYZ direction: ±0.1mm each(3σ) (*2)
Payload 2kg (*3)
Cleanliness ISO Class 1
Mass 160kg
Environment Temperature 5-40°C(Atomosphere side) / 5-80°C(Arm Unit)
Humidity 20-70%, No condensation
Pressure Atmospheric pressure 〜 10-6Pa

*1 Transfer perfomance differs from the standard when options are added.
*2 by in our evaluation conditions
*3 including Hand-base,Hand and Wafer