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Wafer Transfer Robot

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UT-VSW3000NS series

For wafers up to 300mm

Double-handled vacuum robot with SCARA arm that contributes to space saving in vacuum transfer area



  • Equipped with a SCARA arm, it is compatible with rectangular transfer modules, contributing to space saving.
  • Double hand mounting for high speed wafer exchange.
  • Equipped with a direct-drive motor for high-precision positioning and greatly reduced vibration during arm operation.
  • Improved trajectory accuracy and positioning accuracy by using steel belts on the arms.
  • Adoption of vacuum bulkhead seals instead of magnetic fluidic seals enables ultra-high vacuum and low outgassing.

Specifications *1

Model UT-VSW3001NS UT-VSW3002NS
Robot Type 5 axis SCARA
Wafer Gripping Method Friction gripping method
Operation Range (*2) W2-axis (Upper wrist axis) 20 - 340 °
W1-axis (Lower wrist axis) 20 - 340 °
B-axis (Elbow axis) 20 - 340 °
A-axis (Shoulder axis) Endless
Z-axis (Elevation axis) 50mm 135mm
Max. Operation Speed W2-axis 150°/sec.
W1-axis 150°/sec.
B-axis Composite interpolation   950 mm/sec.
Z-axis 32mm/sec.
Repeatability XYZ direction: P-P 0.05 mm each (*3)
Payload 1.0kg (*4)
Cleanliness ISO Class 1
Mass Approx. 260 kg Approx. 285 kg
Environment Temperature 5-40°C(Robot body) / 5-80°C(Arm)
Humidity 20-70%, No condensation
Pressure Atmospheric pressure 〜 10-6Pa

*1 Transfer perfomance differs from the standard when options are added
*2 Some arm positions are restrictive
*3 by in our evaluation conditions
*4 including Hand and Wafer