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Wafer Transfer Robot

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UT-AXW3000NS series

For wafers up to 300mm

Vertically articulated SCARA arm robot that contributes to space saving in atmospheric transfer areas



  • Vertically articulated and 2-axis horizontal SCARA motion contributes to minimize transfer space in EFEM
  • Wafer gripping method can be either vacuum chuck or pneumatic edge clamp.
  • Built-in aligner type will be released
Current robot transfer width

Current robot transfer width

New robot transfer width

New robot transfer width

  • Supports 3 to 5 ports with a wide range of vertical and horizontal access.

Specifications *1

Model UT-AXW3000NS UT-AXW3001NS
Robot Type 6 axis Vertical Articulated Type
Wafer Gripping Method Vacuum check / Edge clamp
Operation Range (*2) X-axis 550 mm
Y-axis 2200 mm 2700 mm
Z-axis 1186 mm 1436 mm
Max. Operation Speed X-axis 1500 mm/sec.
Y-axis 1500 mm/sec.
Z-axis 1500 mm/sec.
Repeatability XYZ direction: ±0.05 mm each (*3)
Payload 1.0kg (*4)
Cleanliness ISO Class 1
Mass Approx. 150 kg Approx. 155 kg
Environment Temperature 5-40°C
Humidity 20-70%, No condensation

*1 Transfer perfomance differs from the standard when options are added
*2 Some arm positions are restrictive
*3 by in our evaluation conditions
*4 including Hand-base,Hand and Wafer