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Wafer Transfer Robot

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For wafers up to 300mm Bernoulli model

Convey of thin wafers


  • Coveyance of thin wafer up to 50µm


Model UTX-RF5500RP
Robot Type 4-axis Cylindrical Coordinate
Operation Range X, A-axis 500mm
θ-axis 340°
Z-axis 300mm
R-axis 183°
Max. Operation Speed X1, X2-axis 800mm/sec.
θ-axis 200°/sec.
Z-axis 200mm/sec.
R-axis 180°/sec.
Cycle Time X1, X2-axis 1.3sec./500mm
θ-axis 2.5sec./340°
Z-axis 2.0sec./300mm
R-axis 2.0sec./180°
Repeatability XYZ direction ±0.1mm each, R-axis ±0.1°
Payload 0.5kg/arm (Including E/E)
Cleanliness ISO Class 3 (ISO-14644)
Mass 33kg
Facilities Air 0.4-0.7MPaG, 200L/min
Power 100-115±10% VAC, 50/60Hz, 5A
Environment Temperature 0-40°C
Humidity 20-70% (No condensation)