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Wafer Aligner

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EG-303 series

For 300mm wafers

Features

  • ウエハ裏面に接触しないエッジグリップタイプ
  • 石英ウエハにも対応可能

Specifications

Model EG-303
Applicable Wafer Size 300mm
Repeatability High Accuracy Mode XY: ±0.05mm θ: ±0.075°
Normal Mode XY: ±0.2mm θ: ±0.1°
Alignment Time High Accuracy Mode Average 7.5sec.
Normal Mode Average 3.5sec.
Cleanliness ISO Class 3 (ISO-14644)
Mass 7kg
Facilities Power 24 VDC 3A
Environment Temperature 0-40°C
Humidity 70% or less (No condensation)